SIP panel with 20 mm (2 cm) PIR core and 1 × 8 mm OSB, termPIR AL

21,35 € incl. VAT

In stock

PIR–OSB SIP panel
PIR core: 20 mm; OSB facing: 1 × 8 mm
Polyisocyanurate (PIR) insulation
SIP panels made to order
Available PIR core thicknesses: 20–200 mm
Available OSB board thicknesses: 8, 10, 12, 18 and 22 mm
Panel width: 1,200 mm
Panel length: 2,500 mm
Area per panel: 3.00 m²
Sales unit: one panel
Gas-tight facing: aluminium-laminated paper plus OSB board
Grade: first grade
Declared thermal conductivity λ: 0.022 W/(m·K)

In stock

Description

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SIP panels

In a lightweight building, combining several layers into one assembly can take a substantial part of the work. SIP panels and PIR boards with OSB facings move some of that work into production. Bonding insulation to a wood-based board helps create an organised assembly with fewer separate operations. It is an option for buyers planning a modular building, conversion or lightweight structure with a clearly defined purpose.

Prefabrication that helps coordinate the work

A ready-made component with insulation and facing allows layers, formats and material requirements to be specified in advance. Fewer separate boards need fitting to the same surface on site. This matters in repeated room layouts, leisure buildings and commercial support spaces. An organised delivery helps the team work smoothly, and the buyer can compare a complete solution rather than several products still needing assembly. Across similar buildings, consistent components can be ordered from an established schedule. This helps plan staged deliveries and the budget for the assembly and its substrate.

OSB provides a rigid surface for subsequent construction, while the PIR core supplies thermal insulation. This combination supports dry construction with fewer processes requiring wet layers to set or dry. It can simplify organisation on a small project. Choosing one-sided or two-sided facings also helps direct spending towards the function of the particular wall, roof or floor section.

Insulation and usability in lightweight buildings

PIR’s low thermal conductivity helps achieve useful thermal resistance within a limited component thickness. This benefits small pavilions and buildings where every area has a planned use. A thinner assembly can preserve room for equipment, circulation or another workstation. Compared with many masonry solutions, the lower weight can suit lightweight structures, subject to the complete design and support arrangement.

Panel load capacity and suitability for an assembly follow from the product documentation and design; the name SIP does not confer these properties on every PIR and OSB board. A properly selected component can nevertheless help plan repeated modules and successive construction stages. Openings, divisions and finishes can be established in advance. For accommodation developments or business facilities, this makes an established layout easier to reproduce in another building.

SteelProfil helps compare SIP panels and PIR boards with OSB against the project. Our range includes first- and second-grade materials and stocked items. Attractive prices and promotions offer further purchasing options. Send the required formats and component uses so we can prepare an appropriate proposal.

SteelProfil range: termPIR

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